IBM Technical Disclosure Bulletin, Volume 27International Business Machines Corporation, 1985 - Electronic digital computers |
Contents
Title | 6360 |
Common Substrate Design for Wirebonded | 6366 |
Address Mapping for a Memory System with | 6368 |
Copyright | |
42 other sections not shown
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Common terms and phrases
algorithm array assembly bits BOOTH'S MULTIPLICATION ALGORITHM boron buffer byte cache capacitor carrier CASCODE cell channel chip circuit clock CMOS component connected Continued cycle decode deposited detector device diode display drive edge electrons etched film filter frequency function gate GRAPHIC CHARACTER implanted initial input interface ion source latch latch-up load logic magnetic mask memory metal method microcode module multiple multiplexer node operation optical output oxide phase photoresist plate polyimide polysilicon position print wheel probe pulse random-access memory reactive ion etching REFLOWED SOLDER regions ribbon scan segments selected semiconductor Serdes service processor shift shown in Fig signal silicide silicon slot solder step stepper motor storage structure substrate surface switch technique thermal thickness timer tion tracks transistor tunneling VLSI voltage wafer wiring