Principles of SolderingGiles Humpston, David M. Jacobson |
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achieved aluminum applied assembly atmosphere atomic binary bismuth Brazing ceramic Chapter chemical cleaning coating components concentration constituents contact angle copper diffusion bonding ductile effect Electron elements Ellingham diagram energy eutectic alloy eutectic solder filler alloy filler metal films flip-chip flux function Gibbs free energy gold heating cycle Humpston hydrogen indium interconnects interface intermetallic compounds joining process joint gap layer lead-free solders lead-tin eutectic lead-tin solder liquid liquidus mechanical properties melting point melting range method microstructure molten filler molten solder nonmetal oxide oxygen package parent materials perature phase diagram preform pressure printed circuit boards process temperature reaction reduced silicon silver solder alloys soldered joints soldering process solid solidified solidus strength stress stress concentration substrate surface tension Technol ternary thermal conductivity thermal expansion thickness tion ture vapor voids volume welding wettable wetting and spreading zinc µin
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Page 15 - R'0 is the drag force per unit projected area of particle, d is the particle diameter, p, is the density of the particle, p is the density of the liquid, and g is the acceleration due to gravity Now, R...