Thin-Film Capacitors for Packaged ElectronicsCapacitors were invented in 1745 and have served as portable electrical charge storage devices ever since. During the 19th century a general understanding of electro-magnetism was gradually developed. Electronic devices and circuits were pioneered in the early 20th century and, by its end, revolutionized the generation, processing, storage and transmission of information. No evolutionary limits have yet been approached. Strictly speaking, all circuits have capacitors; often not wanted, considered parasitic capacitors, such as capacitance of signal interconnections. A great deal of effort in academia and industry attempts to reduce the value of the parasitic capacitors by means of novel materials and structures with the lowest dielectric constant. Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, |
Contents
III | 1 |
IV | 4 |
VI | 5 |
VII | 6 |
VIII | 7 |
XI | 10 |
XIII | 11 |
XV | 15 |
L | 92 |
LI | 95 |
LII | 96 |
LIII | 97 |
LIV | 98 |
LVI | 101 |
LVII | 103 |
LIX | 105 |
XVI | 16 |
XVII | 18 |
XXI | 19 |
XXII | 20 |
XXIII | 21 |
XXIV | 24 |
XXVI | 27 |
XXVII | 28 |
XXVIII | 30 |
XXIX | 34 |
XXX | 35 |
XXXII | 36 |
XXXV | 37 |
XXXVI | 38 |
XXXVII | 40 |
XXXVIII | 43 |
XXXIX | 53 |
XLI | 54 |
XLII | 56 |
XLIII | 60 |
XLIV | 63 |
XLVI | 75 |
XLVII | 87 |
XLVIII | 88 |
XLIX | 91 |
Other editions - View all
Thin-Film Capacitors for Packaged Electronics Jain Pushkar,Eugene J. Rymaszewski Limited preview - 2011 |
Thin-Film Capacitors for Packaged Electronics Jain Pushkar,Eugene J. Rymaszewski No preview available - 2011 |
Thin-Film Capacitors for Packaged Electronics Jain Pushkar,Eugene J. Rymaszewski No preview available - 2014 |
Common terms and phrases
A/cm² aluminum applications BOCA values bottom electrode breakdown field breakdown voltage capacitance density capacitor structure chamber chip circuits connections decoupling capacitors decreasing flow rate deposition rates dielectric constant dielectric dispersion dielectric film dielectric loss dielectric material discrete capacitors E. J. Rymaszewski electric field electrical breakdown electrical properties electrolytic capacitors embedded capacitors experimental ferroelectric film capacitors film thickness films deposited flow rate mode function hysteresis impedance increase insertion loss insulator integration interface layers leakage current density loss tangent measured metal MIS capacitor mtorr MV/cm bias non-cooled O₂ on-chip oxygen flow rate oxygen partial pressure packaging paraelectric parameters polyimide power distribution range reactive sputtering sccm schematic self-resonance frequencies shown in Figure Si3N4 and Ta₂Os signal silicon SiO2 sputtering ion current steady-state oxygen partial stoichiometric substrate substrate temperature surface Ta₂O5 Ta₂Os tantalum oxide films target Technol test vehicle thermal thin thin-film capacitors total inductance
Popular passages
Page 143 - ALS Loke, J. Wetzel, P. Townsend, T. Tanabe, R. Vrtis, M. Zussman, D. Kumar, C. Ryu, and S. Wong, IEEE Trans. Electron Dev. 46, 2178 (1999).