Proceedings of the 4th International Microelectronics Conference: May 28-30, 1986, International Conference Center, Kobe, Japan |
Common terms and phrases
adhesion alumina alumina substrate aluminum applications arrays assembly baking ball bonds bonding capacitance capacitor ceramic ceramic substrate characteristics chip carriers circuit co-fired coefficient components composite conductor connection convection oven copper copper ball cure cycles developed devices dielectric constant dissipation factor electrical electrodes epoxy Figure firing temperature formed glass green sheets heat heat-spreader high density high temperature humidity hybrid IMC 1986 Proceedings IMST increase insulating layer insulation resistance Japan Kobe laminated laser laser trimming low temperature manufacturing materials measured metal method mils module multilayer ceramic OVCC oven oxide package pads paste pattern pitch plating polyimide polymer printed properties reliability resin resistance values resistor samples semiconductor sensor sheet resistivity shown in Fig shows silicon sintered solder space strength structure substrate surface mounting Table thermal conductivity thermal resistance thick film voltage VPCH wire bonding wiring