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adhesion alumina alumina substrate aluminum applications arrays assembly baking ball bonds capacitance capacitor cavity ceramic ceramic substrate characteristics chip carriers circuit co-fired coefficient components composite conductor connection convection oven copper copper ball cure cycles developed devices dielectric constant dissipation factor electrical electrodes epoxy etched evaluation Figure firing temperature formed glass heat heat-spreader high density high temperature humidity hybrid IMC 1986 Proceedings IMST increase insulating layer insulation resistance Japan Kobe laminated laser laser trimming lead low temperature manufacturing materials measured metal method mils module oxide package pads paste pattern photolithography plating polyimide polymer printed properties reliability resin resistance values resistor samples semiconductor sensor sheet resistivity shown in Fig shows silicon silver sintered solder strength structure substrate surface mounting Table technique thermal conductivity thermal resistance thick film thick film resistor trimming voltage VPCH wire bonding