Epoxy Resin Chemistry: Based on a Symposium Sponsored by the Division of Organic Coatings and Plastics at the 176th Meeting of the American Chemical Society, Miami Beach, Florida, September 11-15, 1978Ronald S. Bauer Based on a symposium sponsored by the Division of Organic Coatings and Plastics Chemistry at the 176th Meeting of the American Chemical Society, Miami Beach, Sept. 11-15, 1978. |
Contents
Photosensitized Epoxides as a Basis for LightCurable Coatings | 17 |
Quaternary Phosphonium Compound Latent Accelerators | 47 |
Development of Epoxy ResinBased Binders for Electrodeposition | 57 |
Copyright | |
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Common terms and phrases
1979 American Chemical 2-ethylhexanoic acid 2,3-epoxy-1-propyl methacrylate American Chemical Society amine concentration anhydride anionic benzene binders blushing carbon-13 nmr carbonate cationic polymerization CHâ‚‚ Chem chlorohydrin ester CO2 CH2 CH coatings copolymers Crivello crosslink density cure rate curing agents curve dehydrochlorination DGEBA diazonium salt distribution of Mc effect epichlorohydrin epichlorohydrin hydrolysis Epon epoxy compound epoxy group epoxy resins equation etching experimental exposure formation formulation glycidyl 2-ethylhexanoate hexafluorophosphate hydantoin hydantoin ring hydrolysis hydroxy diester hydroxyl groups increase laminate materials mechanism meq/g meq/g-sample mercury arc mixture modulus MOLE FRACTION molecular weight monomer obtained phosphonium phosphonium compounds photoinitiators photosensitized prepolymer primary amine primary microgels properties pyridine Q-e values quaternary phosphonium ratio react reactivity ring closure room temperature secondary amine secondary microgels shown in Figure shows sodium hydroxide solution solvent stoichiometry structure substituents tack-free Tanaka tertiary amine tetrahydrofuran triarylsulfonium salts VINYLPYRIDINE viscosity