1993 International Symposium on Microelectronics: Proceedings : 9-11 November, 1993, Dallas Convention Center, Dallas, Texas |
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Page 11
... surface is realized using a " sandwich " structure . The main element , built with a ceramic substrate of 2 mm of thickness , supports mechanical actions and is the base for the electronics on the opposite side . On the active surface ...
... surface is realized using a " sandwich " structure . The main element , built with a ceramic substrate of 2 mm of thickness , supports mechanical actions and is the base for the electronics on the opposite side . On the active surface ...
Page 194
... SURFACE AREA ( μm ) 10000 Fig . 2 Relationship between D.O.P of polyimide and viapost surface area Figure 3 shows the relationship between y values and the rotation time of the spinner . The height of the viapost was varied between 12 ...
... SURFACE AREA ( μm ) 10000 Fig . 2 Relationship between D.O.P of polyimide and viapost surface area Figure 3 shows the relationship between y values and the rotation time of the spinner . The height of the viapost was varied between 12 ...
Page 333
... Surface Materials characterization : chemical analysis were performed with a Digital Instruments Nanoscope II atomic ... surface is not smooth enough for direct thin film metallization . A polyimide planarization layer could make the ...
... Surface Materials characterization : chemical analysis were performed with a Digital Instruments Nanoscope II atomic ... surface is not smooth enough for direct thin film metallization . A polyimide planarization layer could make the ...
Contents
20 | 4 |
3D Green Tape Planar Langmuir Sensor Structures | 20 |
A Pressure Sensor Comprised of Diamond J L Davidson | 26 |
Copyright | |
57 other sections not shown
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achieved addition adhesive allows applications assembly bond capacitor ceramic chip circuit cleaning coating components conductive conductor conventional cost crack cycling defect density deposition determined developed diamond dielectric display effect electrical electronic etching experiments fabrication factor failure Figure firing flux formed glass Green heat higher hybrid improvement increase initial interconnect joint laser layer lead limit manufacturing material measured mechanical metal method Microelectronics observed oxide package pads paste pattern performance pitch plating polyimide powder present printed probe problem production properties range reduced reliability removed residue resistance resistor samples selected sensor shown in Figure shows silver sintering solder solution strain strength stress structure substrate surface Table tape temperature thermal thick film thickness thin typical values volume wire