Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1975 - Microelectronics |
Contents
Memory Devices | 1 |
Testing Problems Associated with a 4096 Bit MOS Memory by Don Knowlton | 8 |
A Testing Turnaround | 16 |
Copyright | |
20 other sections not shown
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Common terms and phrases
aluminum analysis application assembly ball bond beam lead devices bipolar bonder capacitors ceramic chip conductor connector cost Cryoseal cycle die attach diffusion electrical Electronic EMCA energy epoxy equipment etching executive computer failure flame function gamma glass gold plated heat hybrid microcircuits input integrated circuits Integrated Injection Logic interconnect interface ion implantation laser layer lead bonding logic machine manufacturers material memory metal method microcomputer microelectronics microprocessor module molded neutron operation output oxide package pads parameters pattern photoresist pins plated frames plated lead frames Plessey polyimide print head production pulse radiation reliability replacement resistance resistor seal semiconductor devices SET F sheet resistance shown in Figure silicon silver migration silver plated lead solder substrate surface tape tarnish technique temperature tester thermal printer thermistor thick film thin film threshold voltage transistors typical voltage wafer wire bonding