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RA System Using Process Failure Analysis for ICs
Dormancy Effects on Nonelectronics
54 other sections not shown
accident aircraft ambulance application assessment calculated circuit codes components consumer crack initiation cycle cost data base data collection decision defined determined distribution dormant electronic engineering equipment estimated ETIP evaluation event example experience factor failed failure analysis failure effects failure mechanisms failure modes failure rate field Figure flight fragment function hazards impact input inspected integrated integrated circuits keyboard lawn mower maintenance major items manufacturing material matrix measures ment method MTBF NASA Nippon Electric Company normally distributed Number of failures obtained operating output parameters Pattern Recognition payload performance prediction probability problem procedures procurement product assurance Product Safety products liability RAM/LOG data Reliability Engineering repair requirements sample specific spline standard statistical stress structure subsystem system reliability Table techniques Technology tion tube U.S. Postal Service UTTAS variables vector warranty Weibull Weibull distribution Y/EER