2000 International Symposium on Microelectronics
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Strategy for Characterizing and Minimizing Charles E Free Zhengrong Tian Middlesex Univer sity Peter Barnwell Heraeus
Reliability and Failure Analysis of CSP under Kim M S Yang J D Mun Daewoo Electronics Co
Corrosion Studies of mBGA Package
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adhesive alloy aluminum analysis applications assembly Ball Grid Array ceramic circuit board components conductor copper cost cure cured films density developed devices dielectric effect electrical electroless Electronic Packaging encapsulation epoxy Espanex etching eutectic evaluation experimental failure fatigue fired film flip chip frequency gold heat sink IEEE IGBT increase inductors integrated interconnection interface laminate laser layer LTCC manufacturing material measured mechanical metal method Microelectronics module moisture MOSFET mounted multilayer optimization parameters performance plastic plating polyimide polymer power electronics printed circuit board properties reflow reliability resin resistance resistor sample semiconductor sensor shear shear strength shown in Figure shows silicon simulation solder ball solder bump solder joint solder paste stress structure substrate surface Table techniques temperature thermal cycling thick film thin film underfill viscosity wafer wire wirebonds