Design and Fabrication of a Surface Micromachined Positioning Device |
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Contents
Introduction | 1 |
Micromechanical system fabrication | 4 |
Micromotion positioning system | 23 |
Copyright | |
8 other sections not shown
Common terms and phrases
aluminium interconnect anneal array beam hinge buckling bulk micromachining capacitance cause chip circuits compressive Conf contact holes Cross-section deflection deposition and patterning determined device displacement dopants doped drive couple electrical electronic processing electrostatic force etch rate etchant fabrication free-standing function Hilton Head Island initial angle layer is deposited load couple LPCVD mask materials mBar measurement mechanical structures microelectronic process micromachined structures micromotors needed object overetching oxide layer P.J. French photolithography photoresist plasma etch polycrystalline silicon polysilicon layer possible problems Proc PSG layer R.F. Wolffenbuttel reduce removed resist resulting rotation sccm second polysilicon Sensors and Actuators shown in Figure signal silicon nitride silicon oxide stiction strain stress stringers structural layers substrate surface micromachining process techniques tensile tensile stress TEOS layer thermal oxide thickness thin films underetching voltage wafer wet etch width Young's modulus