Electronic Materials and Processes Handbook
Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.
What people are saying - Write a review
We haven't found any reviews in the usual places.
adhesive alloys alumina aluminum nitride applications assembly ASTM atoms beryllium brazing capacitors ceramic chemical chip circuit card coating coefficient components composition conductors copper corrosion cure density deposit devices die attach dielectric constant dissipation factor elastomers electrical resistance electrons electroplating epoxy etching evaporation fabrication Figure flow flux glass gold heat sink higher holes increases insulation interconnection intermetallic ions lamination layer lead LTCC magnetic manufacturing material mechanical properties metal methods molding multilayer nickel oxide oxygen package parameters particles percent phase piezoelectric plastic plating polyimide polymers printed circuit range reflow resin resistors result semiconductor shear shown in Fig silicon silver solder balls solder joint solder paste solvent strength stress structure substrate surface mount TABLE temperature tensile thermal conductivity thermal resistance thermoplastics thick film thin film tion transistor ture types typically underfill viscosity voltage wafer wire bonding
Electronic Packaging and Interconnection Handbook 4/E
Snippet view - 2005