Electronic Materials and Processes Handbook

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McGraw Hill Professional, Aug 7, 2003 - Technology & Engineering - 800 pages
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Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.

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Contents

I
1-1
II
2-1
III
3-1
Copyright

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About the author (2003)

Charles A. Harper is President of Technology Seminars, Inc., of Lutherville, Maryland, an organization dedicated to presentation of educational seminars in the field of electronic packaging and materials. He has authored over a dozen well known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of The Johns Hopkins School of Engineering, where he also served as Adjunct Professor.

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