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OPTICAL SYSTEMS AND SUBSYSTEMS
SESSION 2A OPTICAL SYSTEMS AND ANALYSIS
6 other sections not shown
aberrations aerial image alignment marks alignment system aluminum astigmatism autofocus bias Brightfield calculated Calma chip chrome coma component contact hole contours contrast coverplate dark field Defect Fidelity defocus depth of focus design rules device dimensions distortion Dry Etched e-beam edge etchrate experimental exposure feature film filter function g-line geometries glass wafers grating helium hexode i-line illumination inspection intensity laser layer lens lenses linewidth machine magnification manufacturing mask measured micron nominal numerical aperture optical lithography Optical Microlithography overlay errors parameters pattern performance photomask photoresist plane position production proximity effect resist image resist process resist thickness resolution reticle SAMPLE scanning shown in Figure shows Sigma silicon simulation spatial filter SPIE structures submicron surface target technique temperature throughput tolerance intervals tungsten silicide variability variation wafer flatness wafer mark wafer stepper wavelength Wet Etched width X/NA yield Zeiss zero