Proceedings

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Dutch Efficiency Bureau, 1993 - Hybrid integrated circuits

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Contents

A H J Tullemans Philips The Netherlands
26
W Claeys Y Danto S Dilhaire A Hijazi V
34
Technology Inc U S
43
Copyright

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adhesives alumina aluminium analysis applications ASICS assembly automotive capacitance ceramic ceramic substrate components conductor conventional copper cost deposited detector developed devices electrical electrolyte electronic emulsion epoxy equipment etching European Hybrid Microelectronics fabrication Figure film technology Flip Chip frequency FSDU gold Green Tape heat hermetic holes hybrid circuits insulation integrated interconnection interface laser soldering lead manufacturing materials measured mechanical memory metal substrates metallisation Microelectronics microns modules multichip multilayer optical package pads parameters pattern performance pitch planar plate polyimide polymer production reflow soldering reliability resistors screen printing semiconductor SESSION 1D SESSION 2A shear shows silicon sensors solder bumps solder joints solder paste solution stacked strength stresses structure substrate surface mount techniques temperature thermal conduction thermal cycling thermal resistance thick film thin film transistor VLSI voltage width wire bonding wire bumping

Bibliographic information

TitleProceedings
ContributorInternational Society for Hybrid Microelectronics Europe
PublisherDutch Efficiency Bureau, 1993
Original fromthe University of California
DigitizedJul 30, 2008
  
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