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Monti A Scavennec and P Le Men
Ultrasonic Ball Wedge Bonding of Aluminium Wires
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adhesion Alphamet alumina aluminium applications AuAl ball bonds capacitance capacitors CC-packages ceramic cermet chips coating components conductivity Conference 1979 current noise curve dependence devices dielectric dissipation dissipation factor effect electronic encapsulated epoxy Erie etching evaporation experimental fabrication Figure filter firing cycles firing temperature frequency function Ghent glass heat hybrid circuit IEEE increase input insulator integrated circuits L-cut layer lead frame manufacturers material measured mechanism mesh metal method Microelectronics NiCr obtained oxide package paper parameters particles pattern performance plastic porcelain enameled preamplifier printed circuit board Proc production range refiring screen printing semiconductor sensor sheet resistivity shown in Fig shows silicon sintering solar cell solder sputtering stability steel structure substrate TABLE technique thermal thick film resistors thin film thin film transistor transistors trimming tuning ultrasonic voltage wedge bonds welding wire bonding