ProceedingsDutch Efficiency Bureau, 1981 - Hybrid integrated circuits |
Contents
Conduction mechanisms in thick film resis | 1 |
A simulative approach of electron conduction in thick film | 11 |
Current noise in thick thin film resistors | 19 |
15 other sections not shown
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Common terms and phrases
alumina alumina substrates amplitude deviation applications Avignon burn-in capacitors ceramic chip carriers chip-carrier coefficient components compositions conductive conductor contamination copper copper system cost curves density developed device dielectric displays effect electrical properties electronic encapsulation epoxy European Hybrid Microelectronics failure Figure firing function furnace glass gold heat hexaboride humidity hybrid circuits Hybrid Microelectronics Conference inks junction coatings lanthanum hexaboride laser laser trimming layer manufacturing materials measured mechanical metal method Microelectronics Conference 1981 micropackages module mounting multilayer obtained oxide package parameters particles paste phase plastic PNP transistors polymer printed printed circuit board production pyrochlore reflow reflow soldering reliability resistance values ruthenium samples screen semiconductor sensitivity sensors sheet resistance shown in Fig shows signal silicon solder stability substrate surface Table techniques temperature TFRS thick film resistors thin film Third European Hybrid transducers transistor trimming voltage wire bonding