Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, Volume 766

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Materials Research Society, 2003 - Semiconductors
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Contents

A Comparison of Novel Interconnect
15
Wafer Thinning for Monolithic 3D Integration
21
Dielectric Glue Wafer Bonding for 3D ICs
27
Copyright

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MRS Proceedings Volume 812/Materials, Technology, and Reliability ...
List all author names: Title of article, in Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004, edited by rj Carter ...
lucy.mrs.org/ publications/ epubs/ proceedings/ spring2004/ f/ index.html

Fraunhofer-Publica
Materials, technology and reliability for advanced interconnects and low-k dielectrics 2004 : Symposium held April 13 - 15, 2004, San Francisco, California, ...
publica.fraunhofer.de/ starweb/ servlet.starweb?path=pub0.web& search=N-32915

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