82 pages matching observed in this book
Results 1-3 of 82
What people are saying - Write a review
A Comparison of Novel Interconnect
Wafer Thinning for Monolithic 3D Integration
Dielectric Glue Wafer Bonding for 3D ICs
35 other sections not shown
MRS Proceedings Volume 812/Materials, Technology, and Reliability ...
List all author names: Title of article, in Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004, edited by rj Carter ...
lucy.mrs.org/ publications/ epubs/ proceedings/ spring2004/ f/ index.html
Materials, technology and reliability for advanced interconnects and low-k dielectrics 2004 : Symposium held April 13 - 15, 2004, San Francisco, California, ...
publica.fraunhofer.de/ starweb/ servlet.starweb?path=pub0.web&