Materials Issues for Advanced Electronic and Opto-electronic ConnectorsJ. Crane, R. Mroczkowski, D. Jeannotte |
Contents
Materials Challenges and Mechanical Requirements | 1 |
Recent Environmental Demands on Automotive Connectors | 17 |
FormabilitySpring Property Factors | 43 |
Copyright | |
5 other sections not shown
Common terms and phrases
adhesive aging annealing applied Au-flashed available stress behavior bend formability circuit coefficient of friction cold rolled commercial conductivity contact force contact geometry contact resistance copper alloys CuFe CuFeSn CuNiSn CuSn decrease deformation density effect elastic springback Electrical Connectors Electrical Contacts Electronic and Opto-Electronic ELECTROTIN fiberoptic Figure 11 films Fretting corrosion characteristics fretting cycles grain Half-Hard higher temperatures hot dipped initial intermetallic compound Issues for Advanced Jeannotte The Minerals load Materials Issues mating force measured micron modulus Ni/P normal force optical fiber Opto-Electronic Connectors Edited oxide parameter phase phosphor bronze pins plating precipitation hardened precipitation hardened alloys radius relaxation properties reliability requirements residual tin thickness rolling direction sample shear banding shown in Figure Sn-40Pb coating solder solid solution Spring-Hard stability strain stress relaxation substrate surface temperature increase tensile thermal thermoplastic tin layer track length Trans transverse unaged voltage wear wedge yield strength Δ Δ Δ