Novel 1.3 Micron High Speed Directly Modulated Semiconductor Laser Device Designs and the Development of Wafer Bonding Technology for Compliant Substrate Fabrication

Front Cover
Cornell University, 2000 - 284 pages

From inside the book

Contents

DEMAND FOR 1 3 µm HIGH SPEED OPTICAL SOURCES
7
InGaAsGaAs LASERS FLIP CHIP BONDED
18
LONGWAVELENGTH LASERS ON GaAs 111B
43
Copyright

4 other sections not shown

Common terms and phrases

Bibliographic information