Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Karl J. Puttlitz, Kathleen A. Stalter

Taylor & Francis, Feb 27, 2004 - Technology & Engineering - 1048 pages

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Bibliographic information

• Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies; Dekker Mechanical Engineering
• Authors: Karl J. Puttlitz, Kathleen A. Stalter
• Edition: illustrated, reprint
• Publisher: Taylor & Francis, 2004
• ISBN: 0824748700, 9780824748708
• Length: 1048 pages
• Subjects: Technology & Engineering / Electronics / General; Technology & Engineering / Electronics / Microelectronics; Technology & Engineering / Materials Science