Mechanics of Solder Alloy InterconnectsThe Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer. |
Contents
Introduction The Mechanics of Solder Alloy Interconnects | 1 |
12 PREVIEW OF CHAPTERS | 5 |
Microstructural Influences on the Mechanical Properties of Solder | 7 |
22 SOLDER MICROSTRUCTURES | 8 |
221 Eutectic Microstructures | 9 |
222 OffEutectic Microstructures | 12 |
223 Precipitated Microstructures | 15 |
225 Intermetallics within the Bulk | 16 |
Life Prediction and Accelerated Testing | 199 |
62 LIFE PREDICTION | 200 |
621 Determination of the Duty Cycle | 201 |
623 Determination of the Strains or Stresses Developed in a Solder Joint | 205 |
63 LIFE PREDICTION APPROACHES | 207 |
641 Influence of the Definition of Failure | 211 |
642 Test Temperature vs Thermal Cycle Range | 219 |
643 Influence of the Cycle Frequency Ramp Rate and Hold Time | 222 |
226 Changes in the Solder through Intermetallic Formation | 21 |
232 Fatigue | 28 |
233 Deformation and Fracture | 35 |
24 CONCLUSION | 39 |
25 ACKNOWLEDGMENTS | 40 |
Interfaces and Intermetallics | 42 |
32 INTERMETALLICS IN THE SOLDER JOINT | 43 |
322 CopperTin Intermetallics | 44 |
323 Other Intermetallics | 46 |
324 Gold Intermetallics | 49 |
325 Intermetallic Growth | 52 |
326 Kinetics of Intermetallic Growth | 54 |
327 Physical Properties of Intermetallics | 60 |
33 EFFECT OF INTERMETALLICS ON THE INTEGRITY OF SOLDER JOINTS | 61 |
332 Fatigue Failures of SoldersBulk | 62 |
334 Fracture of Hard SoldersThrough Intermetailic | 63 |
Failure Through the Intermetallic | 65 |
34 RECENT ADVANCES IN MICROSTRUCTURAL ANALYSIS OF INTERMETALLICS | 66 |
342 Activation Energy and Composite Solders | 74 |
Constitutive Models | 87 |
411 Organization of the Chapter | 92 |
422 Anelastic Viscosity Parameter and Characteristic Relaxation Time Based on Grain Boundary Sliding | 97 |
423 Microplasticity | 102 |
424 Creep Plasticity | 104 |
425 Experiments to Examine Constitutive Behavior and Measure Constitutive Parameters | 114 |
Experiment Phenomenology and Microscopic Theory | 120 |
427Application of the Constitutive Models | 135 |
43 THEORETICAL ASPECTS OF CONSTITUTIVE MODELLING | 142 |
432 Application to the Mechanics of Solder Joints | 146 |
433 Numerical Implementation | 149 |
434 Example Calculation | 150 |
435 Conclusions | 153 |
Prediction of Solder Joint Geometry | 158 |
52 OBJECTIVES | 159 |
531 Reflow Soldering | 160 |
532 Wave Soldering | 162 |
54 SURFACE TENSION THEORY | 164 |
542 Problem Formulations | 167 |
55 MODELS FOR PREDICTING SOLDER JOINT GEOMETRY | 176 |
551 TwoDimensional Models | 177 |
552 Axisymmetric Models | 182 |
553 General ThreeDimensional Models | 188 |
56 FUTURE RESEARCH NEEDS | 194 |
57 ACKNOWLEDGMENTS | 195 |
65 INTEGRATED MATRIX CREEP STRAIN APPROACH | 256 |
66 ENERGY APPROACHES FOR FATIGUE LIFE PREDICTION | 259 |
67 ENGELMAIER RELIABILITY MODEL | 265 |
68 CRACK PROPAGATION APPROACHES | 274 |
69 INFLUENCE OF COMPOSITION AND MICROSTRUCTURE | 285 |
610 ISOTHERMAL THERMAL AND THERMOMECHANICAL FATIGUE | 294 |
6101 Accelerated Life Testing | 298 |
6102 Isothermal Mechanical Acceleration Factors | 299 |
Thermomechanical Fatigue Tests | 304 |
611 CONCLUSION | 305 |
Thermomechanical Modeling of Solder JointsNumerical Considerations | 314 |
72 PURPOSE OF NUMERICAL MODELING | 316 |
73 BOUNDARY VALUE REPRESENTATIONS OF PHYSICAL PROBLEMS | 317 |
731 Constitutive Relations | 320 |
732 Boundary Conditions | 326 |
733 Initial Conditions | 327 |
735 Finite Element Assumptions | 329 |
74 CONCLUSIONS | 330 |
ApplicationsThroughHole | 336 |
82 MODELING CONSIDERATIONS | 338 |
822 Materials and Material Response | 340 |
823 Loading and Initial Conditions | 341 |
824 Miscellaneous Assumptions | 344 |
83 EXAMPLES | 345 |
832 ThroughHole Solder Interconnection | 352 |
84 CONCLUSION AND RECOMMENDATIONS | 358 |
Surface Mount Solder Joints Under Thermal Mechanical and Vibration Conditions | 361 |
92 FINE PITCH TSOP SOLDER JOINTS UNDER THERMAL CONDITIONS | 363 |
922 Test SetUp and Boundary Conditions | 367 |
923 Statistical Analysis of Test Results | 368 |
924 Failure Analysis of TSOP Solder Joints | 374 |
925 Typel and Typell TSOP Solder Joints | 376 |
93 FINE PITCH LARGE QFP SOLDER JOINTS UNDER BENDING AND TWISTING CONDITIONS | 385 |
932 Bending Test of the QFP Assembly | 388 |
933 Twisting Test of the QFP Assembly | 391 |
94 SURFACE MOUNT CONNECTOR SOLDER JOINTS UNDER VIBRATION CONDITIONS | 396 |
942 Solder Joint Cross Sections | 402 |
943 InPlane Vibration Test of the Connector Assemblies | 406 |
944 OutofPlane Vibration Test of the Connector Assemblies | 408 |
95 CONCLUSION | 410 |
96 ACKNOWLEDGMENTS | 412 |
Common terms and phrases
analysis applied approach ASME assembly axisymmetric behavior CHMT coarsening Coffin-Manson component constant constitutive model contact angles copper correlation crack growth rate Cu3Sn curve cycle frequency cycles to failure deformation developed deviatoric dislocation displacement effect elastic Electronic Packaging energy Engelmaier Equation eutectic exponent fatigue fillet finite element fracture Frear grain boundary grain boundary sliding high strain hold hysteresis loop IEEE increase inelastic interface intergranular isothermal joint geometry lead leadless linear linear elastic load drop material matrix mechanical metal microstructure Morris number of cycles parameters Pb-Sn phase predict printed wiring board ramp rate reflow sample shear strain shear stress shown in Figure shows Sn-Pb Solder Alloy solder interconnection solder joint Solder Joint Reliability Solomon specimen strain rate stress relaxation substrate tensile tensor test board thermal cycling thermomechanical through-hole through-hole solder tion total strain Trans TSOP Vaynman Wassink wave soldering