Microelectromechanical Systems: (MEMS)American Society of Mechanical Engineers, 2000 - Electromechanical devices |
Contents
Novel Micromachining Processes and Packaging for MEMS | 35 |
Dmitri Routkevitch | 45 |
MEMS Applications I | 57 |
Copyright | |
48 other sections not shown
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Common terms and phrases
actuator alumina amplitude analysis anodic anodic alumina applied array ASME calculated cantilever capacitance capacitor cell channel chip clamp coefficient curvature deflection deformation device diameter diaphragm displacement drive dynamic electrical electrode electrostatic electrostatic actuation Engineering equation etching experimental fabrication process flow rate fluid force function heat transfer hydrogel IEEE increases layer lever linear load magnetic material maximum measured mechanical membrane MEMS-Vol micro micro-coil Micro-Electro-Mechanical Systems MEMS microactuator microchannel microcilia Microelectromechanical Systems microfin microfluidic microphone microstructures mirror plate modulus motion NiTi nitride optical optimal oscillator oxide parameters parylene photoresist piezoelectric piezoresistive piezoresistor plasma Hall polysilicon pressure pull-in ratio residual stress resistance resonance frequency Reynolds number sensitivity Sensors and Actuators shape shape memory alloy shown in Figure silicon silicon nitride simulation structure substrate surface micromachining switch Technology temperature thermal thickness thin film torsional values valve velocity vibration voltage wafer waveguide width Young's modulus