ITherm 2000: the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000, Volume 2

Components, Packaging & Manufacturing Technology Society

IEEE, 2000 - Science

Contents

• Study of Thermal Characteristics on Solder and Adhesive Bonded: 1
• Optimization of Plate Fin Heat Sinks Using Entropy Generation: 8
• A Novel Heat Sink Design For Low Speed Flows A BGA Example: 16

Bibliographic information

• Title: ITherm 2000: the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, presented at Las Vegas, Nevada, USA, May 23-26, 2000, Volume 2; ITherm 2000: The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Presented at Las Vegas, Nevada, USA, May 23-26, 2000, Components, Packaging & Manufacturing Technology Society
• Author: Components, Packaging & Manufacturing Technology Society
• Editors: J. Richard Culham, Gary B. Kromann, Koneru Ramakrishna
• Publisher: IEEE, 2000
• Original from: the University of California
• Digitized: Aug 1, 2011
• Subjects: Ball grid array technology; Electronic apparatus and appliances; Heat sinks (Electronics); Science / Mechanics / Dynamics / Thermodynamics; Technology & Engineering / Electronics / General