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2000 Inter Society acceleration airﬂow analysis applied ASME ball grid array base boiling boundary conditions bubble calculated channel component computational condenser conﬁguration cooling copper crack growth creep deﬁned deformation delamination device diameter effect Electronic Packaging equation eutectic experimental fatigue crack ﬁeld Figure ﬁlm ﬁn ﬁrst Flip Chip ﬂow ﬂow rate ﬂuid forced convection function geometry heat ﬂux heat pipe heat sink heat source heater increase Inter Society Conference interface JEDEC layer liquid lnter load material maximum measured mechanical method module Nusselt number ofthe parameters plastic plate porous predicted pressure drop printed circuit board ratio reliability Reynolds number shear shear stress shown in Fig signiﬁcant simulation solder joints solution speciﬁc strain rate stress structure substrate surface Technology test section themial thennal thermal conductivity thermal cycling thermal resistance thermosyphon thickness transient two-phase underﬁll vapor velocity