IEEE MTT-S International Microwave Symposium Digest, Volumes 1-3
Detailing new design techniques, novel technical approaches, and product descriptions in the growing microwave field, this conference addresses subjects that are key to discovering successful solutions to current applications and research technical problems. Wireless and vehicle applications are the focus of emerging commercial applications.
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Table of Contents
Message from the Technical Program Chairmen
Technical Sessions 319
7 other sections not shown
algorithm ampliﬁer amplitude analysis antenna applications array attenuation bandwidth bias calibration capacitance cavity characteristic impedance characteristics chip coefﬁcients components computed conﬁguration coplanar coupler coupling device dielectric constant diode efﬁciency electric ﬁeld Electronics elements equations FDTD Figure ﬁlter ﬁrst frequency function GaAs gain gate harmonic HEMT Heterojunction Bipolar Transistors Hopf bifurcations IEEE IEEE MTT-S IEEE Trans impedance input power insertion loss integrated integrated circuit intermodulation Ka-band laser linear measured MESFET method microstrip line Microwave Microwave Theory Tech mixer MMIC mode modulation monolithic noise ﬁgure nonlinear on-wafer operation optical optimization oscillator output power package parameters performance phase noise port power ampliﬁers probe pulse reﬂection resonator S-parameters Schottky diode shown in Fig signal simulation structure substrate switch technique temperature thermal transistor transmission line V-band voltage W-band wave waveguide wire bonding