System on Package : Miniaturization of the Entire System: Miniaturization of the Entire System (Google eBook)
McGraw Hill Professional, Jan 1, 2008 - Electronic books - 785 pages
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
27 pages matching SOP book by Swaminathan in this book
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Introduction to the SystemonPackage SOP Technology
Introduction to SystemonChip SOC
Stacked ICs and Packages SIP
10 other sections not shown
adhesive antenna applications assembly balun bump capacitance ceramic challenges chip carrier chip stacking circuit CMOS computing copper core cost coupling decoupling density developed devices dielectric constant electrical electromagnetic Electronic electroplating embedded capacitors embedded passives etching fabrication film filter flip chip frequency functions heat IC packages IEEE IEEE Transactions implementation increase inductor Integrated Circuits integration interface laser layer layout materials measured mechanical memory MEMS metal method miniaturization mixed-signal models module Moore’s law multilayer noise on-chip optical interconnects optimization optoelectronic pads parameters passive components performance photoresist pitch plane polyimide polymer Proc processor reduce reliability resistance resistors resonator semiconductor sensors shown in Figure signal silicon simulation SOC design solder structure substrate surface switching system-level techniques Technology Conference temperature thermal thickness thin thin-film transistor Tummala underfill vias voltage wafer wafer-level waveguide wire bonding wireless