System on Package : Miniaturization of the Entire System: Miniaturization of the Entire System (Google eBook)
McGraw Hill Professional, Jan 1, 2008 - Electronic books - 785 pages
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
26 pages matching SOP book by Swaminathan in this book
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1 Introduction to the SystemonPackage SOP Technology
2 Introduction to SystemonChip SOC
3 Stacked ICs and Packages SIP
10 other sections not shown
adhesion Advanced Packaging antenna applications assembly balun bandwidth biosensor bump capacitance carbon nanotubes ceramic challenges chip stacking circuit CMOS Components and Technology computing copper core cost decoupling density developed devices dielectric constant electrical electroplating embedded passives etching fabrication film filter flip-chip frequency functions heat IC packages IEEE IEEE Transactions implementation increase inductors integration interface laser layer low-K materials measured mechanical MEMS metal method microvia miniaturization mixed-signal models module Moore’s law multilayer on-chip optical interconnects optimization optoelectronic pads parameters passive components performance photoresist pitch plane plating polyimide polymer Proc processor reliability resistance resistors resonator semiconductor sensors shown in Figure signal silicon simulation solder SOP technology stresses structure substrate surface switching system-level techniques Technology Conference temperature thermal thickness thin thin-film Tummala underfill VCSEL vias voltage wafer waveguide wire bonding wireless