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Contents
10 other sections not shown Common terms and phrasesadhesion Advanced Packaging antenna applications assembly balun bandwidth biosensor bump capacitance carbon nanotubes ceramic challenges chip stacking circuit CMOS Components and Technology computing copper core cost decoupling density developed devices dielectric constant electrical electroplating embedded passives etching fabrication film filter flip-chip frequency functions heat IC packages IEEE IEEE Transactions implementation increase inductors integration interface laser layer low-K materials measured mechanical MEMS metal method microvia miniaturization mixed-signal models module Moore’s law multilayer on-chip optical interconnects optimization optoelectronic pads parameters passive components performance photoresist pitch plane plating polyimide polymer Proc processor reliability resistance resistors resonator semiconductor sensors shown in Figure signal silicon simulation solder SOP technology stresses structure substrate surface switching system-level techniques Technology Conference temperature thermal thickness thin thin-film Tummala underfill VCSEL vias voltage wafer waveguide wire bonding wireless Bibliographic information
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