International Hybrid Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1970 - Hybrid integrated circuits |
Contents
Business Prospectus for the Seventies | 428 |
Turner and H Blazek Naval Weapons Center | 465 |
G Smith and L Little Beckman Instruments | 486 |
16 other sections not shown
Common terms and phrases
adhesion Alloys Unlimited alumina assembly automated beam capacitance capacitors ceramic chip coating components compositions conductor conductor pattern corrosion cost cycle dielectric durometer effect electrical electronic emulsion Engineering epoxy equipment fabrication failure firing temperature flip-chip flux Formon glass content gold heat hermetic hybrid circuits Hybrid Microelectronics inch inks integrated circuits interconnection interface laser trimming lead manufacturing material mechanism mesh metal method microcircuits Microelectronics module MOSFET multilayer operation oxide package palladium particle Pd-Ag Photoetched Pont Pressure production ratio reliability samples screen printing sealing semiconductor shear rate sheet resistance shown in Figure silicon silver solder Speed squeegee standard stripe substrate surface Table tantalum techniques thermal conductivity thick film thick film circuits thick film hybrid thick film resistors thin film Thixotropy tion transistors ultrasonic viscosity voltage width wire bonding