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Alloys Unlimited alumina assembly automated beam beam-lead capacitance capacitors ceramic chip coating conductor pattern cost cycle devices dielectric discrete components durometer effect electrical electronic emulsion Engineering epoxy equipment fabrication failure firing temperature flip-chip flux glass content gold heat hermetic hybrid circuits Hybrid Microelectronics inch inks integrated circuits interface laser trimming layer lead manufacturing material mechanism mesh metal stripes method Microelectronics modules multilayer operation oxide package pads particle Pd/Au Pont printed circuit board production ratio reflow soldering reliability resistor trimming samples screen printing sealing semiconductor shear rates sheet resistance shown in Figure silicon silver solder squeegee substrate surface Table tantalum techniques termination thermal conductivity thick film thick film circuits thick film hybrid thick film resistors thin film thixotropy tion transistors ultrasonic viscosity voltage width Wire Bond