Modeling of Materials and Its Applications in Advanced TechnologiesC. H. Chu This book contains the proceedings of Symposium L of the International Conference on Materials for Advanced Technologies, held from the 1st to the 6th of July, 2001 in Singapore. The aim of this important meeting was to bring together researchers and engineers having very different backgrounds, and thus promote free discussion and the exchange of ideas across many interdisciplinary boundaries. |
Contents
Preface V | 1 |
A SelfConsistent Scheme for Asperity Contact | 17 |
Novel Methods to Measure Residual Stresses in Thin Films | 31 |
Copyright | |
14 other sections not shown
Common terms and phrases
alloys analysis angle applied approach atoms bonded boundary calculations components composite considered constant corresponding crack curve deflection deformation density dependence determined developed direction disk distribution dynamic effect elastic electronic element energy Engineering equation experimental experiments fibre field Figure finite foam force frequency friction function given grain grain boundary increasing initial interface lattice layer liquid loading manufacturing material matrix maximum mean measured mechanical membrane metal method modulus observed obtained occurs parameters particle performed phase Phys plane plastic polymer potential predicted present pressure properties pump punch range ratio reduction residual stress respectively sample Science selection shape shear shown shows simulation singular sintering solid specimen strain strength stress structure supported surface temperature tensile thermal thickness thin University void volume