Soldering Processes and Equipment

Michael Pecht

Wiley, Jun 18, 1993 - Technology & Engineering - 312 pages

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

About the author

MICHAEL G. PECHT received his MS in Electrical Engineering and PhD in Engineering Mechanics from the University of Wisconsin-Madison. Currently, he is a Chair Professor and the Director of the CALCE Electronic Products and Systems Center at the University of Maryland. He has written eighteen books and served as Chief Editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is currently the Chief Editor for Microelectronics Reliability International. He also serves as a consultant providing expertise to companies on strategic planning, design, and test and risk assessment of electronics products and systems.

Bibliographic information

• Title: Soldering Processes and Equipment
• Editor: Michael Pecht
• Edition: illustrated
• Publisher: Wiley, 1993
• ISBN: 047159167X, 9780471591672
• Length: 312 pages
• Subjects: Technology & Engineering / Electronics / General