1998 International Conference on Multichip Modules and High Density Packaging
Institute of Electrical and Electronics Engineers, 1998 - Business & Economics - 547 pages
Now in its seventh year, MCM has expanded to reflect the evolution and applications since 1992. The MCMs most commonly envisioned in 1992 interconnected 60 to 100 chips on a thin film substrate.
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Building a Domestic High Density Flip Chip Organic Hideki Kusamitsu Y Morishita K Maruhashi M
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adhesion aluminum applications array assembly Ball Grid Array bond pads capacitance capacitors carrier ceramic Chip Scale Packaging circuit conductor copper defect deposition developed devices diameter dielectric electrical encapsulant epoxy etching evaluation fabrication failure flex flip chip flux gold heat sink High Density high frequency IEEE increase inductors integrated interconnect laminate laser layer layout low cost manufacturing material MCM design MCM-D MCM-L MCOF measured mechanical metal method MMIC mounted Multichip Modules multilayer optimization panel parameters passive components performance pitch plate polyimide probe production reduced reflow reliability resistance resistors samples semiconductor shown in Figure shows signal silicon simulation solder balls solder joint standard stress structure substrate surface Table techniques temperature test vehicle thermal conductivity thermal cycling thick film thin film transmission lines typical underfill vias voltage wafer wire bonding yield