1998 International Conference on Multichip Modules and High Density Packaging

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Institute of Electrical and Electronics Engineers, 1998 - Business & Economics - 547 pages
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Now in its seventh year, MCM has expanded to reflect the evolution and applications since 1992. The MCMs most commonly envisioned in 1992 interconnected 60 to 100 chips on a thin film substrate.

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Contents

Building a Domestic High Density Flip Chip Organic Hideki Kusamitsu Y Morishita K Maruhashi M
1
Adhesion Evaluation of Adhesiveless Metal Lee University of Colorado
7
Multichip Packaginc in QFPs by PBOMultilayer
29
Copyright

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