1996 International Symposium on Microelectronics: 8-10 October, 1996, Minneapolis Convention Center, Minneapolis, Minnesota |
Contents
Design Automation Methodology for Simultaneous 071 Piezoelectric Thick Films for Ultrasonic Transducer Arrays | 1 |
Joint Time and Frequency Domain Model of PowerGround Session | 7 |
Thermal Transient Testing Interconnnection Systems | 18 |
Copyright | |
46 other sections not shown
Common terms and phrases
adhesion alloy aluminum applications assembly ball ball bond ball grid array barrier metals bond pad capacitance capacitors ceramic characteristics circuit cofired components composite copper cost cure density deposition developed devices diameter die attach dielectric constant effect electrical Electronic Packaging encapsulants epoxy eutectic evaluation fabrication factor firing flip chip frequency gold heat IEEE increase inductance inductors interconnect interface intermetallic laser layer LTCC main cycle manufacturing material measured metal method Microelectronics microns microwave mini-cycles module noise parameters particles performance polyimide polymer PQFP printing properties reflow reliability resin resistance resistors resonant samples semiconductor sensors shear strength sheet resistance shown in Figure shows simulation solder bumps solder joint solder paste strain stress structure substrate surface Table tape techniques temperature thermal cycling thick film resistor thin film typical voltage wafer width wire bonding