93 pages matching Electronic Packaging ASME in this book
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MATERIALS AND PROCESSES
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active layer adhesive alloy analysis angle annealing applied axial behavior bonding calculated chip circuit board components copper Cr electroplated layer crack length cylinder decreases deformation device diameter dielectric layer disk displacement distribution dynamic effect electrical Electronic Packaging ASME electroplated encapsulant epoxy equation eutectic evaluated experimental failure fatigue crack fiber orientation Figure film thickness finite element flaw flip chip fracture mechanics fracture surface fracture toughness free surface frequency heat increase interconnect interface laser load material maximum measured mechanical properties method microstructural molding compound obtained optical Packaging ASME 1992 parameters plastic strain polyimide pressure printed circuit board reliability residual stress resin shearing stress shown in Fig shows simulation solder joint specimen strain gauge strain rate stress intensity factor substrate technique Technology tensile tensile stress thermal expansion thermal stress thermode blade thermography thin TiN film voids wafer X-ray Young's modulus