Sensors, Update 12Henry Baltes, W. Göpel, Gary K. Fedder, J. Hesse, Jan G. Korvink Sensors Update ensures that you stay at the cutting edge of the field. Built upon the series Sensors, it presents an overview of highlights in the field. Coverage includes current developments in materials, design, production, and applications of sensors, signal detection and processing, as well as new sensing principles. Each volume is divided into three sections. Sensor Technology, reviews highlights in applied and basic research, Sensor Applications, covers new or improved applications of sensors, Sensor Markets, provides a survey of suppliers and market trends for a particular area. With this unique combination of information in each volume, Sensors Update will be of value for scientists and engineers in industry and at universities, to sensors developers, distributors, and users. |
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a-Se a-Si a-SiN achieve Actuators alignment amplitude analyte appliances applications assembly Baltes bandpass filter bandwidth BAW filters BAW resonator bias cantilever capacitance capacitors charge injection Chem chip chopper amplifier Cint circuit circuitry CMOS coated coefficient common-mode components coupling density deposited detection detector devices dielectric dielectric constant electrical Electroanalysis electrodes equivalent input noise fabrication factor feedback fiber H layer IBias IEEE impedance input integration interdigitated interface leakage current material measured mechanical membrane MEMS metal mirror mobile phone mode modular modulator Nafion noise offset optical oscillator output parameters phase phosphor film photodiode piezoelectric piezolayer pixel polymer Proc Q-values range ratio redox reduce resistors resonance frequency RF filters sampling Schematic Schottky diode sensitivity shown in Figure signal silicon SPIE stack structure substrate switch temperature thermal thermal noise thickness tion transconductance transfer function transistor typical voltage Wheatstone bridge x-ray