Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI: 23-24 January, 2007, San Jose, California, USA

Allyson L. Hartzell, Rajeshuni Ramesham

SPIE, 2007 - Technology & Engineering - 246 pages

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Bibliographic information

• Title: Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI: 23-24 January, 2007, San Jose, California, USA; Proceedings of SPIE Reliability, packaging, testing, and characterization of MEMS/MOEMS VI; Volume 6463 of Proceedings of SPIE Series; Volume 6463 of Proceedings of SPIE--the International Society for Optical Engineering, ISSN 0277-786X
• Editors: Allyson L. Hartzell, Rajeshuni Ramesham
• Contributor: Society of Photo-optical Instrumentation Engineers
• Edition: illustrated
• Publisher: SPIE, 2007
• ISBN: 0819465763, 9780819465764
• Length: 246 pages
• Subjects: Technology & Engineering / Nanotechnology & MEMS