The International Journal for Hybrid Microelectronics: An Official Publication of the International Society for Hybrid Microelectronics, Volumes 9-11International Society for Hybrid Microelectronics, 1986 - Microelectronics |
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adhesion AIN substrates alumina alumina substrate analysis Analyzer atmosphere bonder capacitance ceramic Chapter chip coating components conductor copper conductors copper thick film cycling developed devices dielectric constant effects electrical Electronics Engineering epoxy equation failure firing temperature furnace glass holes hybrid circuit Hybrid Microelectronics Volume IEEE insulation interconnect intermetallic International Journal International Society ISHM Journal for Hybrid laser cut laser trim layer load manufacturers materials measured mechanical mesh metal microinches micron molding compound multilayer nitrogen nitrous oxide noise oxide oxygen P.O. Box package pads paper parameters particle paste pattern properties reflow reflow solder reliability resistor Reston sample semiconductor sheet resistivity SHM SHM SHM shown in Figure silicon sintering snap-off Society for Hybrid solder squeegee strate strength structure substrate surface mount Table technical Technology thermal thick film tion ultrasonic voltage wafer wire bonding