Fundamentals of Microsystems Packaging (Google eBook)

Front Cover
McGraw Hill Professional, May 8, 2001 - Technology & Engineering - 967 pages
2 Reviews
"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP

Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find:


*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing"

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Contents

THE ROLE OF PACKAGING IN MICROELECTRONICS
44
THE ROLE OF PACKAGING IN MICROSYSTEMS
80
Mechanical Systems iMEMS Products
113
Copyright

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Rao Tummala, " Fundamentals of Microsystems Packaging" ... Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the ...
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SMART Group
Now Rao has produced Fundamentals of Microsystems Packaging with mcgraw Hill which is aimed at new engineers and students alike, but is also aimed at a ...
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flipchips Dot Com Book Review, "Fundementals of Microsystems ...
"Fundamentals of Microsystems Packaging," by Rao Tummala ... "Fundamentals of Microsystems Packaging" is an informative, well-written textbook, ...
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红樱桃化学化工论坛Fundamentals of Microsystems Packaging Fundamentals of Microsystems packagingby Rao Tummala Publisher: mcgraw-Hill Professional Number Of ...
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Undergraduate microsystems packaging education: needs, status and ...
Undergraduate Microsystems Packaging Education: Needs, Status and Challenges. Rao Tummala and Leyla Conrad. Packaging Research Center ...
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Fundamentals of Microsystems Packaging(页1) - 【化工学院区 ...
[img]http://ecx.images-amazon.com/images/I/51bbmbmki0l.jpg[/img]Fundamentals of Microsystems packagingby Rao tummalapublisher: mcgraw-Hill Professional ...
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Barnes & Noble.com - Books: Fundamentals of Microsystems Packaging ...
Fundamentals of Microsystems Packaging, Tummala, Rao Tummala, Hardcover, 1, Book, ISBN: 0071371699, Engineering, Barnes & Noble.com.
search.barnesandnoble.com/ Fundamentals-of-Microsystems-Packaging/ Rao-Tummala/ e/ 9780071371698

Fundamentals of Microsystems Packaging - المهندس
Fundamentals of Microsystems Packaging مكتبة الهندسة الميكانيكية.
www.almohandes.org/ vb/ showthread.php?t=15626

Mahesh G Varadarajan
Fundamentals of Microsystems Packaging; Ed. Rao R Tummala, mcgraw Hill , NY , 2001 2. Advanced Electronic Packaging; Ed. William D Brown, IEEE Press, 1999 ...
www.cedt.iisc.ernet.in/ people/ mahesh/ mahesh_gv.htm

Rao R. Tummala: Publications (full list)
James E. Morris, “The Role of Packaging in Microelectronics” Fundamentals of Microsystems Packaging, mcgraw-Hill, 2001, pp. 44-79. ...
www.raotummala.com/ publications.htm

About the author (2001)

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

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