Microelectronic Failure Analysis: Desk Reference : 2002 SupplementThis book/CD-ROM package, the 2002 Supplement to the Microelectronic Failure Analysis Desk Reference, 4th edition, is the second update to the 4th edition, following the 2001 Supplement. The main themes addressed are analysis techniques for submicron defects, failure analysis of microelectromechani |
Contents
Investigation of a Low Voltage PWB CAF Failure | 107 |
Application of Scanning Acoustic Microscopy to Electric and Electronic Parts | 115 |
Chiaki Miyasaka Bernhard Tittman | 125 |
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Acoustic Microscopy Analysis Techniques analyzed Application Atomic Auger Electron Backside Bond capacitance cause Ceramic Capacitors Characterization CMOS coating components contamination copper cross-sectional damage defect delamination depth profiling dielectric Diodes dopant electrical Electron Beam electron holography Electron Microscopy elements encapsulation energy epoxy etch Evaluation Failure Analysis failure mechanism Failure Mode film Focused Ion Beam frequency GaAs gate oxide hologram HRTEM Infrared inspection Integrated Circuits interface Laser layer lens material measurements MEMS MESFET metal method Micro Microelectronic molding nitrogen content Non-Destructive Optical p-n junction Packages particle Plastic polysilicon Probe Raman region Reliability resistors sample preparation Secondary Ion Semiconductor Devices shown in Figure signal silicon silver sulfide SIMS Solder specimen Spectroscopy sputter stiction structures substrate sulfur surface tantalum tantalum capacitor Technology temperature Testing Thermal thickness thin TMAH tool Transistors Transmission Electron Microscopy VLSI Voltage Contrast wafer wave X-ray