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3,3'-diaminobenzidine acid chloride aliphatic amine anhydride aromatic nylon aromatic polyimides aromatic polysulfones Bisphenol bond CH3 CH3 chemical resistance coatings commercial Copolymer crosslinked cure degradation diamine dianhydride Dielectric strength Dimethylacetamide Dissipation factor E. I. du Pont Electrical Properties elongation Eponol epoxy resin ester ether exposure fibers Flexural strength given in Table glass grams H film heating high-temperature hours FIG imide indicated in Fig indicated in Table Insulation Isophthalic Kapton laminates linear polymers m-Phenylenediamine magnet wire materials modulus molding compounds mole molecular weight nitrogen Nomex Nomex paper obtained p-xylylene Parylene percent phenolic phenoxy resins Plastics PMDA poly polyamic acid polyamide-imide polybenzimidazoles polycyclamide polyester polyimide polymeric polyphenylene oxide polyxylenol processing produced Pyre ML pyrolysis reactants reaction relative humidity room temperature shear strength shown in Fig shown in Table soluble solution solvent species structure synthesis Tensile strength terephthalate Test thermal stability Thermogram thermoplastic Typical Union Carbide varnish viscosity weight loss