28th Electronic Components Conference, Disneyland Hotel, Anaheim, CA, April 24-26, 1978 |
Contents
RELIABILITY | 1 |
Thermal Compression Bonding Failures Due | 7 |
Modelling Variable Hazard Rate Life Data R | 16 |
Copyright | |
23 other sections not shown
Common terms and phrases
adhesive alignment alumina analysis application calculated capacitance capacitors CdSe CdSe film ceramic chip coefficient components conductive conductor connector contact resistance contamination copper cycle density devices dielectric diodes effect electrical electrode encapsulant epoxy equation failure rate ferrule fiber filter fingers firing frequency function glass gold grams heat sink hybrid circuit laser laser trimming layer lead low ohmic manufacturing material maximum measured mechanism metal method micropore module ohm/square operation optical optical fibers oxide package pads parameters particle parylene pattern Pd/Ag performed PIND test plated plot printed printed circuit board probe production pulse pyrochlore Q-factor range reflow reliability resistor samples screen sheet resistivity shown in Figure shows solder stress substrate surface Table tantalum tantalum nitride tape techniques temperature terminations thermal thick film resistor thin film tion titanium trimming values voltage wave soldering wire bonds