Proceedings: 4th European Hybrid Microelectronics Conference, Copenhagen, Denmark, May 18-19-20, 1983

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International Society for Hybrid Microelectronics Europe - Hybrid integrated circuits - 563 pages
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Contents

Failure Mechanisms in ThickFilm Layers
1
Thick Film Resistors LTTFR M Ciez Current and Noise Measurements on Low Temperature
13
Materials and Processes for Reliable Soldering of Chip Components W Leibfried
39

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