Proceedings: 4th European Hybrid Microelectronics Conference, Copenhagen, Denmark, May 18-19-20, 1983International Society for Hybrid Microelectronics Europe, 1983 - Hybrid integrated circuits - 563 pages |
Contents
Properties of Thick Film Conductors | 1 |
Current and Noise Measurements on Low Temperature | 13 |
Ageing Mechanisms and Stability in Thick Film Resi | 20 |
54 other sections not shown
Common terms and phrases
4th European Hybrid active adhesion strength alumina alumina substrate applications behaviour burn-in capacitance capacitor ceramic substrate chip carrier coating coefficient components conductive conductor copper curing density devices dielectric diode drift Duroid electrical electronic encapsulated epoxy equation equipment European Hybrid Microelectronics fabrication failure fibre Figure filter fired frequency function glass gold heat source hole humidity hybrid circuits increased integrated circuits interconnection ISHM laser laser trimming layer manufacturing material measurements mechanical metal method microwave multilayer nitrogen obtained optical overglaze oxide oxygen package pads parameters paste performance printed circuit boards production reflow soldering reliability resin resistors resonators screen printing semiconductor sensor sheet resistance shown silicone solder cream solder joints solvent stress structure substrate Table technique temperature TFRS thermal resistance thermistors thick film thick film resistors thin film trimming vapor phase voltage wire bonded