1995 International Symposium on Microelectronics: 24 - 26 October 1995, Los Angeles, California |
Contents
Hard Ball Grid Arrays for Pluggable BGA Connector | 1 |
Highly Reliable Ceramic BGA Dave Kellerman MATERIAL SOLUTIONS John Bugeau | 13 |
Voiding Mechanism in BGA Assembly 083 Metal Impregnated Carbon Composites for Thermal | 24 |
Copyright | |
30 other sections not shown
Common terms and phrases
adhesion alloy alumina aluminum applications assembly ball grid array bond pads capacitance capacitor ceramic characteristics circuit cofired components composite conductor contact angle copper cost cycles delamination density developed devices die attach dielectric dielectric constant effect electrical electronic encapsulant epoxy evaluation fabrication firing flip chip flux frequency gold grid array ground plane heat IEEE increasing integrated interconnect interface ISHM lamination laser layer LTCC manufacturing material measured metal Microelectronics microstrip microwave mold mounting Multichip Modules multilayer package parameters performance pitch planarization plasma plated polyimide polymer printed properties reflow reflow soldering reliability resistors samples sensor shear sheet resistance shown in Figure shows signal silicon silver simulation solder bumps SPP system stress structure substrate surface Table tape technique temperature thermal conductivity thermal resistance thick film thin film trim voiding voltage wire bond