1995 International Symposium on Microelectronics: 24 - 26 October 1995, Los Angeles, California |
Contents
Hard Ball Grid Arrays for Pluggable BGA Connector | 1 |
Highly Reliable Ceramic BGA Dave Kellerman MATERIAL SOLUTIONS John Bugeau | 13 |
Voiding Mechanism in BGA Assembly 083 Metal Impregnated Carbon Composites for Thermal | 24 |
Copyright | |
30 other sections not shown
Common terms and phrases
adhesion allows analysis applications array assembly attach ball bond bumps ceramic characteristics chip circuit components composite conductor connection constant copper cost cycles density determined developed devices dielectric effect electrical electronic encapsulant epoxy evaluation fabrication factor Figure firing flip flux frequency glass gold ground heat improved increasing integrated interconnect interface International laser layer lead loss lower manufacturing material measured mechanical metal method Microelectronics module mounting package paste pattern performance pitch plated presented printed properties range reduced reliability resistance resistors samples sensor shown in Figure shows signal silver solder spacing standard strength stress structure substrate surface Table tape technique temperature thermal thermal conductivity thick film thin typical values voiding voltage wire