1995 International Symposium on Microelectronics: proceedings : 24-26 October, 1995, Los Angeles Convention Center, Los Angeles, California

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ISHM-The Microelectronics Society, 1995 - Microelectronics - 562 pages
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Contents

Hard Ball Grid Arrays for Pluggable BGA Connector
1
Highly Reliable Ceramic BGA Dave Kellerman MATERIAL SOLUTIONS John Bugeau
13
Voiding Mechanism in BGA Assembly 083 Metal Impregnated Carbon Composites for Thermal
24
Copyright

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