1995 International Symposium on Microelectronics: 24 - 26 October 1995, Los Angeles, California |
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Page 285
... chip Mounting Technology The primary bare - chip mounting methods are discussed below . ( 1 ) TCP method to ... Flip - chip method A bare chip is mounted on a printed wiring board with the face down ( circuit side This down ) . method ...
... chip Mounting Technology The primary bare - chip mounting methods are discussed below . ( 1 ) TCP method to ... Flip - chip method A bare chip is mounted on a printed wiring board with the face down ( circuit side This down ) . method ...
Page 365
... Chip Assembly Technique for SAW Devices H.Yatsuda and T. Eimura Japan Radio Co. , Ltd . 2-1-4 Fukuoka , Kamifukuoka , Saitama Japan Phone : + 81-492-66-9311 Fax ... FLIP 365 ISHM '95 PROCEEDINGS Flip-Chip Assembly Technique for SAW Devices.
... Chip Assembly Technique for SAW Devices H.Yatsuda and T. Eimura Japan Radio Co. , Ltd . 2-1-4 Fukuoka , Kamifukuoka , Saitama Japan Phone : + 81-492-66-9311 Fax ... FLIP 365 ISHM '95 PROCEEDINGS Flip-Chip Assembly Technique for SAW Devices.
Page 366
... chip is very sensitive . In another example of a flip - chip assembly for IC devices , gold bumps with conductive adhesive are applied [ 4 ] . In this case a resin is needed in order to connect mechanically a chip with a substrate . The ...
... chip is very sensitive . In another example of a flip - chip assembly for IC devices , gold bumps with conductive adhesive are applied [ 4 ] . In this case a resin is needed in order to connect mechanically a chip with a substrate . The ...
Contents
Hard Ball Grid Arrays for Pluggable BGA Connector | 1 |
Highly Reliable Ceramic BGA Dave Kellerman MATERIAL SOLUTIONS John Bugeau | 13 |
Voiding Mechanism in BGA Assembly 083 Metal Impregnated Carbon Composites for Thermal | 24 |
Copyright | |
30 other sections not shown
Common terms and phrases
adhesion allows analysis applications array assembly attach ball bond bumps ceramic characteristics chip circuit components composite conductor connection constant copper cost cycles density determined developed devices dielectric effect electrical electronic encapsulant epoxy evaluation fabrication factor Figure firing flip flux frequency glass gold ground heat improved increasing integrated interconnect interface International laser layer lead loss lower manufacturing material measured mechanical metal method Microelectronics module mounting package paste pattern performance pitch plated presented printed properties range reduced reliability resistance resistors samples sensor shown in Figure shows signal silver solder spacing standard strength stress structure substrate surface Table tape technique temperature thermal thermal conductivity thick film thin typical values voiding voltage wire