Optical Microlithography, Volume 772SPIE--the International Society for Optical Engineering, 1987 - Integrated circuits |
Contents
PRACTICAL ISSUES | 21 |
OPTICAL SYSTEMS AND SUBSYSTEMS | 41 |
SESSION 2A OPTICAL SYSTEMS AND ANALYSIS | 73 |
Copyright | |
6 other sections not shown
Other editions - View all
Common terms and phrases
aberrations aerial image alignment marks alignment system astigmatism autofocus bias Brightfield calculated Calma chip chrome coma component contact hole contours contrast coverplate dark field defocus depth of focus design rules device dimensions distortion Dry Etched e-beam edge Effective Defect Capture etchrate experimental exposure feature film filter g-line geometries glass wafers grating helium hexode i-line illumination inspection intensity laser layer lens lenses linewidth machine magnification manufacturing mask measured micron mJ/cm² nominal Number of Points numerical aperture optical lithography Optical Microlithography oxide parameters pattern performance photomask photoresist position production proximity effect resist image resist process resist thickness resolution reticle scanning shown in Figure shows Sigma silicon simulation spatial filter SPIE structures submicron surface technique temperature tolerance intervals tungsten silicide variability variation wafer flatness wafer mark wafer stepper wavelength Wet Etched width X-AXIS yield Zeiss zero