Proceedings of the Conference on Hybrid Microelectronics, Tuesday 9th to Thursday 11th September 1975, University of Technology, Loughborough |
Contents
Surface area structure and composition of debased | 1 |
Substrate bowing in thick film multilayered circuits | 17 |
High tensile strength thick film silverpalladium | 23 |
Copyright | |
23 other sections not shown
Common terms and phrases
Ag-Pd Alsimag alumina alumina substrates amplifier applications assembly capacitance capacitor ceramic chip components compositions conductivity coupler cure described devices dielectric diode display effect electrical Electronic emitter Engineering epoxy equation fired fired film frequency glass gold heat sink high voltage humidity hybrid circuits hybrid microcircuits Hybrid Microelectronics impedance increase input insulation integrated circuits interconnection interface Johnson Matthey laser trimming layer layout limited linear machine manufacture material measured metal method microstrip nickel conductors node noise index obtained ohms operation opto-isolator output oxide packing density pattern performance Plessey possible probe problems produced pulse range ratio resistors samples sheet resistivity shown in Figure shows soda lime soldered Stemag substrate surface area Table temperature distribution thermal thick film thick film circuits thick film resistors thin film track transducer transistors typical values width wire bonding