International Integrated Reliability Workshop Final Report

Front Cover
IEEE Electron Devices Society, 1999 - Integrated circuits
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Contents

Signal Margin Test to Identify Process Sensitivities Relevant to DRAM Reliability and Functionality
6
Reliability Test Results for W FIB Interconnect Structures
14
Predicting Plasma Charging Damage to Ultrathin Gate Oxide by Using Nondestructive DCIV Technique
24
Copyright

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