1997 International Symposium on Microelectronics: Proceedings : October 14-16, 1997, Pennsylvania Convention Center, Philadelphia, PennsylvaniaIMAPS--International Microelectronics and Packaging Society, 1997 - Electronic packaging - 707 pages Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF). |
Contents
Wireless | 1 |
097 | 28 |
Performance of Buried Resistors in Green | 48 |
Copyright | |
46 other sections not shown
Common terms and phrases
adhesive aluminum applications array assembly ball Ball Grid Array capacitance capacitors ceramic circuit coating components conductor configuration copper cost cure cycle delamination density deposition developed devices dielectric constant effect electrical electronic encapsulation epoxy evaluation fabrication ferrite filter flip chip flux frequency GaAs glass heat pipe heat sink heat spreader impedance increase integrated interconnect interface JEDEC layer LTCC manufacturing material measured meniscus metal Microelectronics microns microstrip microwave mils module molding mounting multilayer optimization parameters passive passive components performance pitch planar plate polyimide polymer production properties reflow reliability resin resistors samples semiconductor sensor SHOCC shown in Figure shows silicon solder bump spin coating stress structure substrate surface Table technique temperature thermal conductivity thermal resistance thermoplastic thick film thin film transistor typical underfill voltage wafer wire wirebonding