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alloy aluminum anode antimony apparatus applied assigned atmosphere barium barium titanate base binder bolometers boron carbon cathode ceramic chamber characteristics chromium coating coefficient of resistance compound comprises conductive crucible crystal deposited desired device dielectric dispersion doping electrical resistance electrodes evaporation example Figure finely divided firing furnace germanium gold heating high resistance impurities inch increase indium oxide inert insulating iridium layer manufacture metal film metal oxide method microns mixed mixture mol percent molybdenum nickel nitride noble metal obtained ohmic ohms ohms per square operation oxygen palladium particles plate platinum powder preferred pressure process developed produce ratio resin resistance elements resistance film resistance material resistance values resistor composition resulting rhenium rhodium ruthenium semiconductor silicon carbide silver sintered Sittig solution specific resistance sprayed sputtering stability substrate suitable surface tantalum temperature coefficient thermistor thickness thin film resistor tin oxide titanium U.S. Patent vacuum vacuum deposition varistor voltage wafer weight wire